ARTICLE IN ACADEMIC JOURNALS
| NO | DETAILS OF ARTICLE IN ACADEMIC JOURNALS |
|---|---|
| 1. |
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping
2024
Author(s) : Goh Yingxin Source :
SOLDERING & SURFACE MOUNT TECHNOLOGY
DOI :
10.1108/SSMT-02-2024-0007
|
| 2. |
Optimization of the manufacturing process and properties of alkali-activated palm oil fuel ash-based cold-bonded aggregates
2024
Author(s) : Goh Yingxin, Mo Kim Hung Source :
JOURNAL OF CLEANER PRODUCTION
DOI :
10.1016/j.jclepro.2024.140714
|
| 3. |
Microbial self-healing in concrete: A comprehensive exploration of bacterial viability, implementation techniques, and mechanical properties
2024
Source :
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
DOI :
10.1016/j.jmrt.2024.01.261
|
| 4. |
High-Temperature Creep Analysis of Carbon Steel A516-Gr70 Used in Thin-Walled Pressure Vessels Under Different Loads at Constant Temperature
2024
Author(s) : Goh Yingxin Source :
ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING
DOI :
10.1007/s13369-024-09124-0
|
| 5. |
Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers
2023
Author(s) : Goh Yingxin Source :
Journal of Materials Science: Materials in Electronics
DOI :
10.1007/s10854-023-11168-1
|
| 6. |
Municipal woody biomass waste ash-based cold-bonded artificial lightweight aggregate produced by one-part alkali-activation method
2023
Author(s) : Goh Yingxin, Mo Kim Hung Source :
CONSTRUCTION AND BUILDING MATERIALS
DOI :
10.1016/j.conbuildmat.2023.131619
|
| 7. |
Identification of different parameters influencing manufacture and properties of municipal woody biomass waste ash based cold-bonded aggregate
2023
Author(s) : Goh Yingxin, Mo Kim Hung Source :
Materials Today: Proceedings
DOI :
10.1016/j.matpr.2023.03.711
|
| 8. |
Microstructure and tensile properties of Sn-Bi-Co solder alloy
2023
Author(s) : Goh Yingxin Source :
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
DOI :
10.1007/s10854-022-09683-8
|
| 9. |
Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers
2023
Author(s) : Goh Yingxin Source :
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
DOI :
10.1007/s10854-023-11168-1
|
| 10. |
Potential of municipal woody biomass waste ash in the production of cold-bonded lightweight aggregates
2023
Source :
Journal of Building Engineering
DOI :
10.1016/j.jobe.2022.105392
|
| 11. |
Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature
2022
Source :
EUROPEAN JOURNAL OF ENVIRONMENTAL AND CIVIL ENGINEERING
DOI :
10.1080/19648189.2020.1734489
|
| 12. |
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review
2022
Author(s) : Goh Yingxin Source :
SOLDERING & SURFACE MOUNT TECHNOLOGY
DOI :
10.1108/SSMT-06-2021-0035
|
| 13. |
The Potential of Geopolymer in Development of Green Coating Materials: A Review
2022
Source :
ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING
DOI :
10.1007/s13369-022-06882-7
|
| 14. |
Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu–Sn–Co multilayers
2021
Author(s) : Goh Yingxin, A.s. Md. Abdul Haseeb Source :
Journal of Materials Science: Materials in Electronics
|
| 15. |
Failure Mechanisms of Structural Bamboo Using Microstructural Analyses
2021
Author(s) : Goh Yingxin, Yap Soon Poh Source :
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
DOI :
10.1155/2021/1571905
|
| 16. |
Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers
2021
Author(s) : A.s. Md. Abdul Haseeb, Goh Yingxin Source :
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
DOI :
10.1007/s10854-021-05612-3
|
| 17. |
Failure Mechanisms of Structural Bamboo Using Microstructural Analyses
2021
Author(s) : Goh Yingxin Source :
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
DOI :
10.1155/2021/1571905.
|
| 18. |
Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature
2020
Source :
European Journal of Environmental and Civil Engineering
DOI :
10.1080/19648189.2020.1734489
|
| 19. |
Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin
2020
Author(s) : Goh Yingxin Source :
Journal of Materials Science: Materials in Electronics
DOI :
10.1007/s10854-020-03006-5
|
| 20. |
Hydraulic and strength characteristics of pervious concrete containing a high volume of construction and demolition waste as aggregates
2020
Source :
Construction and Building Materials
DOI :
10.1016/j.conbuildmat.2020.119251
|
| 21. |
Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers
2018
Author(s) : A.s. Md. Abdul Haseeb, Goh Yingxin Source :
Journal of Materials Science: Materials in Electronics
|
| 22. |
Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates
2018
Source :
Journal of Cleaner Production
DOI :
https://doi.org/10.1016/j.jclepro.2018.01.205
|
| 23. |
Composition estimation of Sn-Bi alloy electrodeposition using polarization curve
2017
Author(s) : A.s. Md. Abdul Haseeb, Goh Yingxin Source :
Journal of Materials Science: Materials in Electronics
DOI :
10.1007/s10854-017-6906-6
|
| 24. |
Studies on electrodeposition behavior of Sn Bi alloys in plating baths modified by hydroquinone and gelatin
2016
Author(s) : A.s. Md. Abdul Haseeb, Goh Yingxin Source :
Journal of Materials Science
DOI :
10.1007/s10853-016-9883-x
|
| 25. |
Deformation and fracture behaviour of electroplated Sn Bi/Cu solder joints
2015
Source :
Journal of Materials Science
|
| 26. |
Formation of Sn-Bi Solder Alloys by Sequential Electrodeposition and Reflow
2013
Author(s) : A.s. Md. Abdul Haseeb, Goh Yingxin Source :
Journal of Materials Science: Materials in Electronics
|
| 27. |
Effects of Hydroquinone and Gelatin on the Electrodeposition of Sn-Bi Low Temperature Pb- Free Solder
2013
Source :
Electrochimica Acta
|
| 28. |
Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder
2013
Source :
ELECTROCHIMICA ACTA
DOI :
10.1016/j.electacta.2012.12.036
|
| 29. |
Electrodeposition of Lead-free solder alloys
2013
Source :
Soldering & Surface Mount Technology
|
CHAPTER IN BOOK
| NO | DETAILS OF CHAPTER IN BOOK |
|---|---|
| 1. |
Recycled Concrete Aggregates: Performance Evaluation in Pervious Concretes
2021
Author(s) : Yap Soon Poh, Goh Yingxin |
| 2. |
Recycling of Construction and Demolition Wastes Into Renewable Construction Materials
2019
|
| 3. |
Bamboo: The Emerging Renewable Material for Sustainable Construction.
2019
Author(s) : Yap Soon Poh, Goh Yingxin |
| 4. |
Electronic Packaging Materials: Properties and Selection
2018
Author(s) : Goh Yingxin |
| 5. |
Electronic Packaging: Sealing
2018
Author(s) : Goh Yingxin |
| 6. |
Electronic Packaging: Thermal, Mechanical, and Environmental Durability
2018
Author(s) : Goh Yingxin |
| 7. |
Electronic Packaging: Lead Frame Materials
2017
Author(s) : Goh Yingxin |
PROCEEDING
| NO | DETAILS OF PROCEEDING |
|---|---|
| 1. |
AN EXPERIMENTAL STUDY OF COMPRESSION LOADING ON FIN HEAT EXCHANGER BASED
ON METAL FOAM AND THERMAL INTERFACE MATERIAL (TIM)
2023
Author(s) : Goh Yingxin |
| 2. |
PROCESS OPTIMIZATION OF AGRICULTURAL WASTE GRANULATION
2023
Author(s) : Goh Yingxin |
| 3. |
MICROSTRUCTURE AND MECHANICAL PROPERTIES OF FE NANOPARTICLES ADDITION ON
SN-AG-CU/CU SOLDER JOINT
2023
Author(s) : Goh Yingxin |
| 4. |
EFFECT OF CO ALLOYING ADDITION ON SN-58BI SOLDER ALLOY
2023
Author(s) : Goh Yingxin |
| 5. |
Electrochemical studies on the effects of additives during Sn-Bi plating
2014
Author(s) : Goh Yingxin |
| 6. |
Deformation and Fracture Behaviour of Electroplated Sn-Bi/Cu Solder Joints
2013
Author(s) : Goh Yingxin |
| 7. |
Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys
2012
Author(s) : Goh Yingxin |
| 8. |
Effects of thiourea and gelatin on the electrodeposition
of Sn-Ag solder alloy
2012
Author(s) : Goh Yingxin, A.s. Md. Abdul Haseeb |
| 9. |
Formation of Sn-Bi alloys through sequential
electrodeposition
2012
Author(s) : Goh Yingxin, A.s. Md. Abdul Haseeb |
| 10. |
Effects of Sn concentration and current density on Sn-Bi
electrodeposition in additive free plating bath
2012
Author(s) : Goh Yingxin, A.s. Md. Abdul Haseeb |
| 11. |
Effects of hydroquinone and gelatin on the
electrodeposition of SnBi low temperature Pb-free solder
2012
|
| 12. |
Effects of Mn nanoparticles on wettability and
intermetallic compounds in between Sn-3.8Ag-0.7Cu and
Cu substrate during multiple reflow
2012
Author(s) : Goh Yingxin, A.s. Md. Abdul Haseeb |
| 13. |
Electrodeposition of Lead-Free Solder For Green Electronics
2011
Author(s) : Goh Yingxin |
RESEARCH PROJECT
| GRANT | PROGRESS | STATUS |
|---|---|---|
|
Metallic Phase Change Materials In Latent Heat Thermal Energy Storage For Higher Efficiency Renewable Energy Harvesting
|
|
on going |
|
A Renewable Approach For Setting Up Rural Electrification In Indigenous Malaysian Villages
Researcher(s) : Professor Ir. Dr. Hazlie Bin Mokhlis, Li Wang |
|
end |
|
Microstructure And Mechanical Properties Of Sn-bi-co Low Temperature Solder Alloy
|
|
end |
RESEARCH COLLABORATOR
| GRANT | PROGRESS | STATUS |
|---|---|---|
|
Additive Manufacturing of Implant Materials
Researcher(s) : Dr. Goh Yingxin |
|
on going |
|
Sustainable Materials For Tomorrow: Development Of Ga2o3 For High Electron Mobility Transistor
|
|
on going |
|
Microbial Self-healing Mechanisms And Post-healing Characterization Of Cracked Concrete
|
|
end |
|
Development Of Green And Space-efficient Low Cost Structures From Renewable And Materials
|
|
end |
|
Microstructural characterization of engineered cementitious materials with enhanced performance
Researcher(s) : Dr. Goh Yingxin |
|
end |