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Assoc. Prof. Ir. Dr. WONG Yew Hoong received his B.Eng. (Hons.) in Materials Engineering and Ph.D. in Electronic Materials from the School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia (USM). Before joining Universiti Malaya (UM), he was a Research Fellow at the Nanyang Technological University (NTU), Singapore. He is now serving as an Associate Professor at the Department of Mechanical Engineering, Faculty of Engineering, UM.

On professional qualifications, he is a Professional Engineer (PEng) in Material Engineering discipline registered with the Board of Engineers Malaysia (BEM), a Chartered Engineer (CEng) registered with the Engineering Council UK, and a Project Management Professional (PMP) registered with the Project Management Institute (PMI), USA.

Dr. Wong is actively engaging himself in research. His main research area is on semiconductor and electronic thin-film materials (including oxides, nitrides, and organic polymers), electronic device fabrication, electronic packaging, and gas sensing materials. To date, he has published more than 90 research papers in high impact factor ISI-indexed journals, 4 invited book chapters, and 1 filed Malaysian patent. His current standing of h-index is 20 (Web of Science) / 20 (Scopus) / 21 (Google Scholar).

Owing to his expertise in the field, he has been invited to serve as a Visiting Professor at the National Tsing Hua University (NTHU), Taiwan in 2018. Recently, he has been appointed as Editorial Board Member of Materials Science in Semiconductor Processing (Elsevier) - a Q1 WoS-ISI journal, a Section Editor of ASM Science Journal - a Scopus journal, and has served as a Guest Editor for Frontiers in Materials - a Q2 WoS-ISI journal. Besides, he also serves as Tunku Abdul Rahman University College (TARUC) Programme Advisory Panel (2021 - 2023). Dr. Wong is also being invited to serve as a reviewer for several refereed journals. To date, he has reviewed more than 230 manuscripts for refereed journals. He is also being invited as an examiner for master and doctoral theses, both internal and external. On top of that, he was being invited several times as invited speaker in various international conferences and seminars.

In the department, he has served as the Programme Coordinator (Head of Programme) for Mechanical Engineering for almost 6 years (2016 – 2021). As for teaching responsibilities, he has been assigned to teach on various courses/subjects, mainly related to Engineering Materials, Semiconductor Manufacturing Processes, and Engineering Project Management, for both under- and postgraduate levels. Thus far, he has taught 11 different undergraduate courses/subjects and 6 different postgraduate courses/subjects in UM.

Dr. Wong is also very active in professional and community activities, particularly in the Institute of Electrical and Electronics Engineers (IEEE) USA, the Institution of Mechanical Engineers (IMechE) UK, the Institution of Engineers Malaysia (IEM), and the Young Scientists Network (YSN) by the Academy of Sciences Malaysia (ASM). 

He is a Corporate Member of IEM (MIEM). He is serving as IEM Coucil Member 2022/2023 and Deputy Chairman of IEM's Material Engineering Technical Division (MaTD) 2021/2022. Prior to that, in IEM, he served as the Secretary-cum-Treasurer of Electronic Engineering Technical Division (eETD) in 2016/2017 and a Committee Member of eETD from 2013 to 2019. He is a Senior Member of IEEE (SMIEEE) and is serving as the Vice-Chair of IEEE – Electronics Packaging Society (EPS) Malaysia Chapter since 2021. Prior to that, he served as its Secretary for 4 years, from 2017 to 2020 and its Executive Committee Member in 2016. He is a Member of IMechE (MIMechE) and is serving as an Academic Liaison Officer (ALO) for the UM-IMechE Student Chapter since 2018 to date. As a Member of YSN-ASM for the term 2020 – 2023, he is serving as a Committee Member in the Science Policy and Governance Working Group in 2021 and in the Research Synergy Working Group in 2022.

Dr. Wong is the recipient of UM Excellence Service Award in 2017 and UM Excellence Service Certificates in 2019 and in 2020. He also won numerous awards at international and national exhibitions pertaining to his research work. Recently, he is being recognized globally by IEEE-EPS, USA and being awarded 2020 EPS Outstanding Young Engineer Award for his contributions to the field of electronic packaging materials and semiconductor fabrication technologies through novel material and process development, as well as continuous service to EPS (https://eps.ieee.org/awards/outstanding-young-engineer-award.html).