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DR. GOH YINGXIN

Department of Mechanical Engineering

Faculty of Engineering

gohyingxin@um.edu.my
Latest Award
Penyelidikan
Penyelidikan
Year 2014
Latest Evaluation
Reviewer for article "Morphologies of Electrochemically Stripped Sn-3.0Ag-0.5Cu-TiO2 Composite Solder by Selective Electrochemical Etching" in Soldering and Surface Mount TechnologyReviewer for article "Morphologies of Electrochemically Stripped Sn-3.0Ag-0.5Cu-TiO2 Composite Solder by Selective Electrochemical Etching" in Soldering and Surface Mount Technology
Reviewer
Year 2019
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Latest Publication
2018

Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

2018

Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates

2017

Composition estimation of Sn-Bi alloy electrodeposition using polarization curve

2016

Studies on electrodeposition behavior of Sn Bi alloys in plating baths modified by hydroquinone and gelatin

2019

Recycling of Construction and Demolition Wastes Into Renewable Construction Materials

2019

Bamboo: The Emerging Renewable Material for Sustainable Construction.

2018

Electronic Packaging: Thermal, Mechanical, and Environmental Durability

2018

Electronic Packaging Materials: Properties and Selection

2014

Electrochemical studies on the effects of additives during Sn-Bi plating

2013

Deformation and Fracture Behaviour of Electroplated Sn-Bi/Cu Solder Joints

2012

Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy

2012

Effects of hydroquinone and gelatin on the electrodeposition of SnBi low temperature Pb-free solder