Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers
Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates
Composition estimation of Sn-Bi alloy electrodeposition using polarization curve
Studies on electrodeposition behavior of Sn Bi alloys in plating baths modified by hydroquinone and gelatin
Electronic Packaging: Thermal, Mechanical, and Environmental Durability
Electronic Packaging Materials: Properties and Selection
Electronic Packaging: Sealing
Electronic Packaging: Lead Frame Materials
Electrochemical studies on the effects of additives during Sn-Bi plating
Deformation and Fracture Behaviour of Electroplated Sn-Bi/Cu Solder Joints
Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy
Effects of hydroquinone and gelatin on the electrodeposition of SnBi low temperature Pb-free solder
