PERSONAL DETAIL


DR. GOH YINGXIN

Department of Mechanical Engineering
Faculty of Engineering
 
  03-79675267
  03-79675317
  gohyingxin@um.edu.my
 Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603 Kuala Lumpur, W.Persekutuan Kuala Lumpur, Malaysia
 
ResearcherID Link
  http://www.researcherid.com/rid/E-1788-2017

ACADEMIC QUALIFICATION
(Qualification), (Institution).



PROFESSIONAL
(Organisation), (Role), (Year), (Level).


  • BOARD OF ENGINEERS MALAYSIA, Graduate Engineer, 2018, (National)

ADMINISTRATIVE DUTIES
(Role), (Level), (Start date),(End Date).


  • KETUA AUDITOR JKA PT01 (AUDIT KENDIRI FAKULTI KEJURUTERAAN NOV2019), Faculty, 12/11/2019 to 14/11/2019
  • SAR2019 JKM CHAPTER 2 CO-WRITER, Faculty, 15/10/2019 to 31/01/2020
  • AJK DAN PENTADBIR LAMAN WEB (WEBMASTER) FAKULTI KEJURUTERAAN, Faculty, 24/07/2019 to 31/12/2020
  • Ahli Jawatankuasa Hal Ehwal Pelajar Jabatan Kejuruteraan Mekanik, Faculty, 01/07/2019 to 31/07/2020
  • Ahli Jawatankuasa Jadual Waktu Jabatan Kejuruteraan Mekanik, Faculty, 01/12/2018 to 30/11/2020
  • PROJECT MANAGER FOR STAFF PROFILE ANALYSIS (ASSIGNED BY DEAN), Faculty, 01/10/2018 to 31/12/2018

AREAS OF EXPERTISE
(Area).


  • Electrochemical Materials
  • Electronic Packaging Materials
  • Packaging Technology and Materials Sn: Including Standard Supporting Technologies
  • Alloy Materials
  • Electronic Materials


RECENT SELECTED PUBLICATIONS
(Publication).


Chapter in Book

2019
  • Yap, S. P., Goh, Y., Mo, k. H. & Ibrahim, H. A. (2019). Recycling of Construction and Demolition Wastes Into Renewable Construction Materials. In Reference Module in Materials Science and Materials Engineering, Elsevier. 
  • Goh, Y., Yap, S. P. & Tong, T. Y. (2019). Bamboo: The Emerging Renewable Material for Sustainable Construction. In Reference Module in Materials Science and Materials Engineering, Elsevier. 

2018
  • Xie, H., Tan, Q., Lee, Y.C., Goh, Y. (2018) Electronic Packaging: Thermal, Mechanical, and Environmental Durability, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 28 October 2015, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02026-9. 
  • Memis, I., Goh, Y. (2018) Electronic Packaging Materials: Properties and Selection, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 20 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02020-8. 
  • Sergent, J.E., Goh, Y. (2018) Electronic Packaging: Sealing, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 2 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02024-5. 

2017
  • Breedis, J.F., Chia, P.Y., Goh, Y. (2017) Electronic Packaging: Lead Frame Materials, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 2 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02023-3. 
Article in Academic Journals

2018
  • Yap, S. P., Chen, P. Z. C., Goh, Y., Mo, K. H., Yuen, C.W. (2018). Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates. Journal of Cleaner Production 181: 155-165. (ISI-Indexed)
  • Y. Goh, Y. S. Goh, E. L. Lee, M. T. Ong, A. S. M. A. Haseeb, ‘Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers’, Journal of Materials Science: Materials in Electronics, 2018, Vol. 29(7), pp. 5791–5798 (ISI-Indexed)

2017
  • Goh, Y., & Haseeb, A.S.M.A. (2017). Composition estimation of Sn–Bi alloy electrodeposition using polarization curve. Journal of Materials Science: Materials in Electronics, 28(15), pp. 11186-11191. (ISI-Indexed)

2016
  • Goh, Y., Haseeb, A.S.M.A., (2016). Studies on electrodeposition behavior of Sn Bi alloys in plating baths modified by hydroquinone and gelatin, Journal of Materials Science 51(12), pp 5823-5833 (ISI-Indexed)

2015
  • Yingxin Goh, A. S. M. A. Haseeb, Haw Ling Liew, Mohd Faizul Mohd Sabri. 2015. Deformation and fracture behaviour of electroplated Sn Bi/Cu solder joints.Journal of Materials Science 50(12): 4258-4269. (ISI/SCOPUS Indexed Publication)

2013
  • Yingxin Goh,Seen Fang Lee, A.S.M.A. Haseeb. 2013.Formation of Sn-Bi Solder Alloys by Sequential Electrodeposition and Reflow. Journal of Materials Science: Materials in Electronics.24(6). 2052-2057. (ISI/SCOPUS Indexed Publication)
  • Yingxin Goh, ASMA Haseeb, MFM Sabri, Effects of Hydroquinone and Gelatin on the Electrodeposition of Sn-Bi Low Temperature Pb-Free Solder, Electrochimica Acta, 90, 265-273 (2013) (ISI/SCOPUS Indexed Publication)
  • Yingxin Goh, ASMA Haseeb, MFM Sabri, 2013, Electrodeposition of Lead-free solder alloys, Soldering & Surface Mount Technology, 25(2), 76-90 (2013) (ISI/SCOPUS Indexed Publication)
Proceeding

2014
  • Goh, Y., Haseeb, A.S.M.A., & Sabri, M.F.M. (2014). Electrochemical studies on the effects of additives during Sn-Bi plating. Paper presented at the International Union of Materials Research Societies – International Conference on Electronic Materials, Taipei, Taiwan. 

2013
  • Goh, Y., Haseeb, A.S.M.A., Liew, H.L. & Sabri, M.F.M. (2013). Deformation and Fracture Behaviour of Electroplated Sn-Bi/Cu Solder Joints. Proceedings of the 15th International Conference on Electronic Materials and Packaging (SIT-0132). Seoul, Korea. (Non-ISI/Non-SCOPUS)

2012
  • Lee, S. F.; Haseeb, A.S.M.A.; Goh Y. (2012). Formation of Sn-Bi alloys through sequential electrodeposition. 4th Asia Symposium on Quality Electronic Design (ASQED), 160 - 163. doi: 10.1109/ACQED.2012.6320493 
  • Chiew, Y. H.; Haseeb, A.S.M.A.; Goh Y.; Lee S. F. (2012). Effects of Sn concentration and current density on Sn- Bi electrodeposition in additive free plating bath. 4th Asia Symposium on Quality Electronic Design (ASQED), 286 - 290. doi: 10.1109/ACQED.2012.6320517 
  • Koh Kai Xiang; Haseeb, A.S.M.A.; Arafat, M.M.; Goh Yingxin (2012). Effects of Mn nanoparticles on wettability and intermetallic compounds in between Sn-3.8Ag-0.7Cu and Cu substrate during multiple reflow. 4th Asia Symposium on Quality Electronic Design (ASQED), 297 - 301. doi: 10.1109/ACQED.2012.6320519 
  • Lee, X. W.; Haseeb, A.S.M.A.; Goh Y. (2012). Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy. 4th Asia Symposium on Quality Electronic Design (ASQED),291 - 296. doi: 10.1109/ACQED.2012.6320518 
  • Goh Y.; Haseeb, A.S.M.A.; Sabri, M.F.M. (2012). Effects of hydroquinone and gelatin on the electrodeposition of SnBi low temperature Pb-free solder. 4th Asia Symposium on Quality Electronic Design (ASQED), 306 - 312. doi: 10.1109/ACQED.2012.6320521 
  • Goh, Y., Lee, S.F., & Haseeb, A.S.M.A. (2012). Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys. Proceedings of the 35th International Electronic Manufacturing Technology Conference (pp. 1-6). DOI 10.1109/IEMT.2012.6521792. (Non-ISI/Non-SCOPUS)

2011
  • Goh, Y., Haseeb, A.S.M.A., & Sabri, M.F.M. (2011). Electrodeposition of Lead-Free Solder For Green Electronics. Proceedings of the 3rd International Congress on Green Process Engineering (pp. 34-42). Kuala Lumpur, Malaysia. (Non-ISI/Non-SCOPUS)

AREAS OF RESEARCH
(Project title), (Role), (From)-(Until), (Level), (Source).


  • Microstructure And Mechanical Properties Of Sn-bi-co Low Temperature Solder Alloy, Principal Investigator(PI), 2019 - 2021, RU Geran - Fakulti Program, (National)
  • Development of Green and Space-efficient Low Cost Structures from Renewable and Materials, Consultant, 2019 - 2021, RU Geran - Fakulti Program, (National)
  • Microstructural characterization of engineered cementitious materials with enhanced performance, Consultant, 2018 - 2019, RU Geran, (National)

AWARDS AND RECOGNITIONS
(Name of Award), (Awarding Institution), (Year Awarded), (Level).


  • Emerald Literati Awards-Outstanding Paper of 2013, Emerald Group Publishing Limited, 2014, (International)

EXPERT/TECHNICAL CONTRIBUTIONS
(Activity), (Organisation), (Role), (From)-(Until), (Level).


  • Member for Centre of Advanced Materials, Centre of Advanced Materials, Faculty of Engineering, University of Malaya, Researcher, 2018, (University)

EVALUATION ACTIVITIES
(Description), (Evaluation Activity),(Year).


  • Reviewer for "Waterproofing Performance of Nano Silicon Based Mortar: A Response Surface Methodology approach", ICOSEM2019, Article In Proceeding ,  (2019 - 2019)
  • Reviewer for "Improvement of Coating Characteristics via Improvised Plasma Electrolytic Oxidation (PEO) Set-up", ICOSEM2019, Article In Proceeding ,  (2019 - 2019)
  • Reviewer for "Force-deflection behavior of NiTi archwire at different configurations of bracket system", ICOSEM2019, Article In Proceeding ,  (2019 - 2019)
  • Reviewer for "Corrosion Resistant Alloy Pipeline – Creating Knowledge behind the Scenes", ICOSEM2019, Article In Proceeding ,  (2019 - 2019)
  • Reviewer for "In situ electron diffraction and resistivity characterization of solid state reaction process in Cu/Al bilayer thin films", Article In Journal ,  (2019 - 2019)
  • Reviewer for article "Anticorrosive Cu-Sn alloy coatings produced by DC and SPC electrodeposition in sodium citrate medium" in Journal of Materials Engineering and Performance, Article In Journal ,  (2019 - 2019)
  • Reviewer for article "Morphologies of Electrochemically Stripped Sn-3.0Ag-0.5Cu-TiO2 Composite Solder by Selective Electrochemical Etching" in Soldering and Surface Mount Technology, Article In Journal ,  (2019 - 2019)
  • Reviewer for article "Fracture Behaviors of Sn3.0Ag0.5Cu/Cu Solder Joints under Thermal-shear Cycling" in Physica B: Condensed Matter, Article In Journal ,  (2018 - 2018)
  • Reviewer for article "Investigation of Anodic Dissolution Behaviour of Intermetallic Compound in Sn-3Ag-0.5Cu Solder Alloy by Cyclic Voltammetry" in Soldering and Surface Mount Technology, Article In Journal ,  (2018 - 2019)
  • Reviewer for article "Predicting fracture of solder joints with different constraint factors" in Fatigue & Fracture of Engineering Materials & Structures, Article In Journal ,  (2018 - 2018)
  • Reviewer for article "The behaviour of steel naked and coated by TiB2 with and without native oxide layer in liquid Sn-Ag-Cu solder melt" in Metallurgical and Materials Transactions B, Article In Journal ,  (2018 - 2018)
  • Reviewer for article "Depolarization effect of Co2+ in the Sn-Co alloy codeposition from methanesulfonic acid electrolyte" in Journal of the Electrochemical Society, Article In Journal ,  (2017 - 2017)
  • Reviewer for article "Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition" in Soldering and Surface Mount Technology, Article In Journal ,  (2016 - 2016)
  • Reviewer for article "Fracture Mechanism of Movable Part in MEMS Device based on Empirical Electron Theory" in Fatigue & Fracture of Engineering Materials & Structures, Article In Journal ,  (2015 - 2015)

CONTRIBUTION TO SOCIETY
(Contribution To Society), (Level), (Start Date), (End Date).


  • Additional Invigilator for Examination Semester 2, Session 2018/2019 (Subject: KIG2009), (Department), 24/06/2019 until 24/06/2019
  • Volunteer for IQ70+ Malaysian Association for the Welfare of Mentally Challenged Children (Volunteer ID:321722-2), (Community), 08/05/2019 until 08/06/2019
  • BEGIN CHALLENGE 2019 (JUDGE), (National), 24/04/2019 until 24/04/2019
  • Volunteer for IQ70+ Malaysian Association for the Welfare of Mentally Challenged Children, The Medical and Casket Giving Charity Fund Program (Volunteer code: 321722), (Community), 28/12/2017 until 28/01/2018

SUPERVISION


FIRST DEGREE/DIPLOMA/PRE-DEGREE
(Course Title), (Academic Session), (No. of Candidates)

Ongoing
  • (1)Microstructure and Nanomechanical Studies on Recycled Polyethylene and Aluminium (PEAL) Composite (2)Deformation of Recycled Polyethylene and Aluminium (PEAL) Composite under Elevated Temperature Conditions, 2019/2020, 2
  • Integrated Design Project: Development of Submerged mini-robo for visualation under water for aquaculture monotoring, 2019/2020, 4