Curriculum Vitae

DR. GOH YINGXIN

Senior Lecturer
  • Department of Mechanical Engineering
    Faculty of Engineering
  • gohyingxin
  • 03-79675267

AREAS OF EXPERTISE

  • ADVANCED PACKAGING TECHNOLOGIES
  • INTERCONNECTS RELIABILITY AND FAILURE ANALYSIS
  • ELECTRONIC MATERIALS AND PROCESSING
  • LEAD-FREE SOLDER ALLOYS
  • SUSTAINABLE MATERIALS
  • SOLDER MATERIALS
  • ELECTRONIC PACKAGING MATERIALS

ACADEMIC QUALIFICATION

  • Doctoral Degree (PhD)
    Universiti Malaya (UM)
  • SARJANA MUDA KEJURUTERAAN (BAHAN) LULUS DENGAN KEPUJIAN (DENGAN CEMERLANG), (Bahan)
    Universiti Malaya (UM)

ADMINISTRATIVE DUTIES

  • LIAISON OFFICER BAGI JABATAN KEJURUTERAAN MEKANIK
    07 Aug 2024 - 01 Mar 2027 (Department)
  • PEGAWAI PERHUBUNGAN INDUSTRI (INDUSTRY RELATIONS OFFICER - IRO)
    09 Feb 2024 - 08 Feb 2026 (University Malaya)
  • AHLI JAWATANKUASA TASKFORCE (PEMBELIAN RMK12)
    11 Mar 2024 - 28 Feb 2025 (Department)
  • Task Force Member
    09 Jan 2024 - 30 Jun 2024 (University Malaya)
  • Menjalankan Fungsi Sebagai Ketua Jabatan
    18 Jun 2024 - 26 Jun 2024 (Department of Mechanical Engineering, Faculty of Engineering)
  • Programme Coordinator
    01 Jan 2022 - 31 Dec 2023 (Department)
  • Committee Members
    23 Aug 2022 - 31 Dec 2023 (Department)
  • Coordinator
    23 Dec 2022 - 31 Dec 2023 (Department)
  • Committee Members
    23 Dec 2022 - 31 Dec 2023 (Department)
  • Coordinator
    01 Jan 2022 - 31 Dec 2022 (Department)
  • Coordinator
    30 Nov 2022 - 30 Nov 2022 (Department of Mechanical Engineering, Faculty of Engineering)
  • Acting Head of Department
    17 Nov 2022 - 22 Nov 2022 (Department)
  • Committee Members
    11 Sep 2022 - 11 Sep 2022 (Department of Mechanical Engineering, Faculty of Engineering)
  • Acting Head of Department
    28 Apr 2022 - 06 May 2022 (Department)
  • Acting Head of Department
    15 Mar 2022 - 18 Mar 2022 (Department)
  • Acting Head of Department
    14 Jan 2022 - 17 Jan 2022 (Department)
  • Ahli Jawatankuasa Jadual Waktu Jabatan Kejuruteraan Mekanik
    01 Dec 2018 - 31 Dec 2021 (Department of Mechanical Engineering, Faculty of Engineering)
  • Member of Teaching Committee
    04 Sep 2020 - 31 Dec 2021 (Department of Mechanical Engineering, Faculty of Engineering)
  • Member of Media Committee
    07 Sep 2020 - 07 Sep 2021 (Department of Mechanical Engineering, Faculty of Engineering)
  • SAR2019 JKM CHAPTER 2 CO-WRITER
    15 Oct 2019 - 31 Dec 2020 (Department of Mechanical Engineering, Faculty of Engineering)
  • AJK DAN PENTADBIR LAMAN WEB (WEBMASTER) FAKULTI KEJURUTERAAN
    24 Jul 2019 - 31 Dec 2020 (Department of Mechanical Engineering, Faculty of Engineering)
  • Ahli Jawatankuasa Hal Ehwal Pelajar Jabatan Kejuruteraan Mekanik
    01 Jul 2019 - 31 Jul 2020 (Department of Mechanical Engineering, Faculty of Engineering)
  • KETUA AUDITOR JKA PT01 (AUDIT KENDIRI FAKULTI KEJURUTERAAN NOV2019)
    12 Nov 2019 - 14 Nov 2019 (Department of Mechanical Engineering, Faculty of Engineering)
  • PROJECT MANAGER FOR STAFF PROFILE ANALYSIS (ASSIGNED BY DEAN)
    01 Oct 2018 - 31 Dec 2018 (Dean Office, Faculty of Engineering)

MEMBERSHIPS

  • EDITORIAL ADVISORY BOARD MEMBER FOR THE JOURNAL SOLDERING & SURFACE MOUNT TECHNOLOGY (ISSN: 0954-0911), BOARD MEMBER
    Since 2024 (International)
  • EXECUTIVE COMMITTEE (INDUSTRY-ACADEMIA LIAISON) OF IEEE EPS MALAYSIA CHAPTER, COMMITTEE MEMBER
    2024 to 2024 (National)
  • IEEE AND IEEE ELECTRONICS PACKAGING SOCIETY MEMBERSHIP, MEMBER
    2023 to 2024 (International)
  • REVIEW EDITOR FOR FRONTIERS IN BUILT ENVIRONMENT, EDITORIAL BOARD
    Since 2022 (International)
  • EXAMINATION AND CERTIFICATION PANEL COMMITTEE MEMBER OF COMMITTEE , MEMBER
    2022 to 2024 (National)
  • WORKING GROUP ON PRODUCT CATEGORY RULES (PCR) FOR TELECOMMUNICATION SITE , MEMBER
    Since 2020 (National)
  • BOARD OF ENGINEERS MALAYSIA, GRADUATE ENGINEER
    Since 2018 (National)
  • INSTITUTE OF MATERIALS MALAYSIA (IMM), ORDINARY MEMBER
    2020 to 2021 (National)

PUBLICATIONS

Article in Journal
WoS
  1. Javeed, Yasmeena; Goh, Yingxin; Mo, Kim Hung; Yap, Soon Poh; Leo, Bey Fen (2024). Microbial self-healing in concrete: A comprehensive exploration of bacterial viability, implementation techniques, and mechanical properties, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T. 29, 2376-2395. doi:10.1016/j.jmrt.2024.01.261
  2. Kamaruzzaman, Lina Syazwana; Goh, Yingxin; Goh, Yi Chung (2024). Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping, SOLDERING & SURFACE MOUNT TECHNOLOGY. . doi:10.1108/SSMT-02-2024-0007
  3. Lin, Jiayi; Tan, Tee How; Yeo, Jerome Song; Goh, Yingxin; Ling, Tung-Chai; Mo, Kim Hung (2024). Optimization of the manufacturing process and properties of alkali-activated palm oil fuel ash-based cold-bonded aggregates, JOURNAL OF CLEANER PRODUCTION. 437. doi:10.1016/j.jclepro.2024.140714
  4. Taherinia, Adel; Eslami, Abdoulmajid; Golozar, Mohammad Ali; Goh, Yingxin; Fadaeifard, Firouz (2024). High-Temperature Creep Analysis of Carbon Steel A516-Gr70 Used in Thin-Walled Pressure Vessels Under Different Loads at Constant Temperature, ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING. . doi:10.1007/s13369-024-09124-0
  5. Kamaruzzaman, Lina Syazwana; Goh, Yingxin (2023). Microstructure and tensile properties of Sn-Bi-Co solder alloy, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 34(4). doi:10.1007/s10854-022-09683-8
  6. Kamaruzzaman, Lina Syazwana; Goh, Yingxin; Chang, Zi Ming; Haseeb, A. S. M. A. (2023). Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. 34(25). doi:10.1007/s10854-023-11168-1
  7. Lin, Jiayi; Tan, Tee How; Yeo, Jerome Song; Goh, Yingxin; Ling, Tung-Chai; Mo, Kim Hung (2023). Municipal woody biomass waste ash-based cold-bonded artificial lightweight aggregate produced by one-part alkali-activation method, CONSTRUCTION AND BUILDING MATERIALS. 394. doi:10.1016/j.conbuildmat.2023.131619
  8. Kamaruzzaman, Lina Syazwana; Goh, Yingxin (2022). Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review, SOLDERING & SURFACE MOUNT TECHNOLOGY. . doi:10.1108/SSMT-06-2021-0035
  9. Soong, Looi Sing; Liu, Michael Yong Jing; Yap, Soon Poh; Mo, Kim Hung; Jumaat, Mohd Zamin; Goh, Yingxin (2022). The Potential of Geopolymer in Development of Green Coating Materials: A Review, ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING. . doi:10.1007/s13369-022-06882-7
  10. Yap, Soon Poh; Goh, Yingxin; Goh, Wan Xien; Mo, Kim Hung; Liu, Michael Yong Jing; Ibrahim, Hussein Adebayo (2022). Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature, EUROPEAN JOURNAL OF ENVIRONMENTAL AND CIVIL ENGINEERING. . doi:10.1080/19648189.2020.1734489
  11. Chahrour, Mutaz K.; Hosen, Md. Akter; Goh, Yingxin; Tong, Teong Yen; Yap, Soon Poh; Khadimallah, Mohamed Amine (2021). Failure Mechanisms of Structural Bamboo Using Microstructural Analyses, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING. 2021. doi:10.1155/2021/1571905
  12. Goh, Y. S., Goh, Y. X., Chia, P. Y., & Haseeb, A. (2021). Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu-Sn-Co multilayers. Journal of Materials Science-Materials in Electronics, 32(7), 9490-9499. doi: 10.1007/s10854-021-05612-3
  13. Goh, Yingxin; Haseeb, A. S. M. A.; Sabri, Mohd Faizul Mohd (2013). Effects of hydroquinone and gelatin on the electrodeposition of Sn-Bi low temperature Pb-free solder, ELECTROCHIMICA ACTA. 90, 265-273. doi:10.1016/j.electacta.2012.12.036
Scopus
  1. Kamaruzzaman L.S., Goh Y., Chang Z.M., Haseeb A.S.M.A. (2023). Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers, Journal of Materials Science: Materials in Electronics. 34(25). doi:10.1007/s10854-023-11168-1
  2. Lin J., Mo K.H., Goh Y., Onn C.C. (2023). Potential of municipal woody biomass waste ash in the production of cold-bonded lightweight aggregates, Journal of Building Engineering. 63. doi:10.1016/j.jobe.2022.105392
  3. Lin J., Mo K.H., Goh Y., Yeo J.S. (2023). Identification of different parameters influencing manufacture and properties of municipal woody biomass waste ash based cold-bonded aggregate, Materials Today: Proceedings. . doi:10.1016/j.matpr.2023.03.711
Others
  1. Goh, Y.S., Goh, Y., Chia, P.Y. et al. Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu Sn Co multilayers. J Mater Sci: Mater Electron (2021). https://doi.org/10.1007/s10854-021-05612-3
  2. Adebayo, H. I., Goh, Y., Ng, Z. A., Yap, S. P., Mo, K. H., Yuen, C.W. & Abutaha, F. 2020. Hydraulic and strength characteristics of pervious concrete containing a high volume of construction and demolition waste as aggregates. Construction and Building Materials 253: 119251.
  3. E. L., Lee, Y. Goh, & A. S. M. A., Haseeb. (2020). Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin. Journal of Materials Science: Materials in Electronics, 31, pp. 4554 4562, DOI: 10.1007/s10854-020-03006-5
  4. Yap, S. P., Goh, Y., Goh, W. X., Mo, K. H., Liu, M. Y. J. & Ibrahim, H. A. (2020). Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature. European Journal of Environmental and Civil Engineering, DOI: 10.1080/19648189.2020.1734489 (ISI-Indexed)
  5. Y. Goh, Y. S. Goh, E. L. Lee, M. T. Ong, A. S. M. A. Haseeb, Formation and characterization of intermetallic compounds in electroplated cobalt tin multilayers , Journal of Materials Science: Materials in Electronics, 2018, Vol. 29(7), pp. 5791 5798
  6. Yap, S. P., Chen, P. Z. C., Goh, Y., Mo, K. H., Yuen, C.W. (2018). Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates. Journal of Cleaner Production 181: 155-165.
  7. Goh, Y., & Haseeb, A.S.M.A. (2017). Composition estimation of Sn Bi alloy electrodeposition using polarization curve. Journal of Materials Science: Materials in Electronics, 28(15), pp. 11186-11191.
  8. Goh, Y., Haseeb, A.S.M.A., (2016). Studies on electrodeposition behavior of Sn Bi alloys in plating baths modified by hydroquinone and gelatin, Journal of Materials Science 51(12), pp 5823-5833
  9. Yingxin Goh, A. S. M. A. Haseeb, Haw Ling Liew, Mohd Faizul Mohd Sabri. 2015. Deformation and fracture behaviour of electroplated Sn Bi/Cu solder joints.Journal of Materials Science 50(12): 4258-4269.
  10. Yingxin Goh, ASMA Haseeb, MFM Sabri, 2013, Electrodeposition of Lead-free solder alloys, Soldering & Surface Mount Technology, 25(2), 76-90 (2013)
  11. Yingxin Goh,Seen Fang Lee, A.S.M.A. Haseeb. 2013.Formation of Sn-Bi Solder Alloys by Sequential Electrodeposition and Reflow. Journal of Materials Science: Materials in Electronics.24(6). 2052-2057.
Chapter in Books
  1. Ibrahim, H. A., Yap, S. P. & Goh, Y., (2021). Recycled Concrete Aggregates: Performance Evaluation in Pervious Concretes. In Recycled Aggregates: Materials and Uses (pp. 27-50), New York, Nova Science Publisher.
  2. Goh, Y., Yap, S. P. & Tong, T. Y. (2019). Bamboo: The Emerging Renewable Material for Sustainable Construction. In Reference Module in Materials Science and Materials Engineering, Elsevier.
  3. Yap, S. P., Goh, Y., Mo, k. H. & Ibrahim, H. A. (2019). Recycling of Construction and Demolition Wastes Into Renewable Construction Materials. In Reference Module in Materials Science and Materials Engineering, Elsevier.
  4. Memis, I., Goh, Y. (2018) Electronic Packaging Materials: Properties and Selection, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 20 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02020-8.
  5. Sergent, J.E., Goh, Y. (2018) Electronic Packaging: Sealing, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 2 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02024-5.
  6. Xie, H., Tan, Q., Lee, Y.C., Goh, Y. (2018) Electronic Packaging: Thermal, Mechanical, and Environmental Durability, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 28 October 2015, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02026-9.
  7. Breedis, J.F., Chia, P.Y., Goh, Y. (2017) Electronic Packaging: Lead Frame Materials, In Reference Module in Materials Science and Materials Engineering, Elsevier, Current as of 2 November 2017, ISBN 9780128035818, https://doi.org/10.1016/B978-0-12-803581-8.02023-3.
Article in Proceeding
  1. Beh, J. Y., Lim, T. Z. Y., Chin, Y. X., Kamaruzzaman, L. S., Goh, Y., & Yakymovych, A. (2023). Microstructure and Mechanical Properties of Fe Nanoparticles Addition on Sn-Ag-Cu/Cu Solder Joint. In Proceedings of the 5th International Conference on the Science and Engineering of Materials 2023 (ICoSEM2023) (pp. 46-50).
  2. Ganesan, P. B., Mohd Zaib, N. F., & Goh, Y. (2023). An Experimental Study of Compression Loading on Fin Heat Exchanger Based on Metal Foam and Thermal Interface Material (TIM). In Proceedings of the 5th International Conference on the Science and Engineering of Materials 2023 (ICoSEM2023) (pp. 108-117).
  3. Kamaruzzaman, L. S., Goh, Y., & Goh, Y. C. (2023). Effect of Co Alloying Addition on Sn-58Bi Solder Alloy. In Proceedings of the 5th International Conference on the Science and Engineering of Materials 2023 (ICoSEM2023) (pp. 51-64).
  4. Shahrom, N. A., Goh, Y., Yap, S. P., Ding, M. H., Yeaw, J. P., & Kek, Y. W. (2023). Process Optimization of Agricultural Waste Granulation. In Proceedings of the 5th International Conference on the Science and Engineering of Materials 2023 (ICoSEM2023) (pp.64-81)
  5. Goh, Y., Haseeb, A.S.M.A., & Sabri, M.F.M. (2014). Electrochemical studies on the effects of additives during Sn-Bi plating. Paper presented at the International Union of Materials Research Societies International Conference on Electronic Materials, Taipei, Taiwan.
  6. Goh, Y., Haseeb, A.S.M.A., Liew, H.L. & Sabri, M.F.M. (2013). Deformation and Fracture Behaviour of Electroplated Sn-Bi/Cu Solder Joints. Proceedings of the 15th International Conference on Electronic Materials and Packaging (SIT-0132). Seoul, Korea.
  7. Chiew, Y. H.; Haseeb, A.S.M.A.; Goh Y.; Lee S. F. (2012). Effects of Sn concentration and current density on Sn- Bi electrodeposition in additive free plating bath. 4th Asia Symposium on Quality Electronic Design (ASQED), 286- 290. doi: 10.1109/ACQED.2012.6320517
  8. Goh Y.; Haseeb, A.S.M.A.; Sabri, M.F.M. (2012). Effects of hydroquinone and gelatin on the electrodeposition of SnBi low temperature Pb-free solder. 4th Asia Symposium on Quality Electronic Design (ASQED), 306 - 312. doi: 10.1109/ACQED.2012.6320521
  9. Goh, Y., Lee, S.F., & Haseeb, A.S.M.A. (2012). Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys. Proceedings of the 35th International Electronic Manufacturing Technology Conference (pp. 1-6). DOI 10.1109/IEMT.2012.6521792.
  10. Koh Kai Xiang; Haseeb, A.S.M.A.; Arafat, M.M.; Goh Yingxin (2012). Effects of Mn nanoparticles on wettability and intermetallic compounds in between Sn-3.8Ag-0.7Cu and Cu substrate during multiple reflow. 4th Asia Symposium on Quality Electronic Design (ASQED), 297- 301. doi: 10.1109/ACQED.2012.6320519
  11. Lee, S. F.; Haseeb, A.S.M.A.; Goh Y. (2012). Formation of Sn-Bi alloys through sequential electrodeposition. 4th Asia Symposium on Quality Electronic Design (ASQED), 160- 163. doi: 10.1109/ACQED.2012.6320493
  12. Lee, X. W.; Haseeb, A.S.M.A.; Goh Y. (2012). Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy. 4th Asia Symposium on Quality Electronic Design (ASQED),291- 296. doi: 10.1109/ACQED.2012.6320518
  13. Goh, Y., Haseeb, A.S.M.A., & Sabri, M.F.M. (2011). Electrodeposition of Lead-Free Solder For Green Electronics. Proceedings of the 3rd International Congress on Green Process Engineering (pp. 34-42). Kuala Lumpur, Malaysia.